And
Packaging Workshop
November
the 8th, 2018
Tours,
France
TECHNICAL
PROGRAMME
Technical Committee: Stéphane BELLENGER, éolane, France – General Chairman
Daniel
ALQUIER, Greman Laboratory, France - Chairman
Christophe
SERRE, ST Microelectronics, France - Chairman
Lars BÖTTCHER, Fraunhofer Institute IZM, Germany
Cyril BUTTAY, Ampère Laboratory, France
Guillaume CALLERANT, Sonceboz S.A., Switzerland
Jean-Luc DIOT, Minapack, France
Marc DUCHOSSOY, Thales Group, France
Sébastien JACQUES, Greman
Laboratory, France
Guo-Quan
LU, Virginia Tech, USA
Jürgen
SCHUDERER, ABB Corporate Research, Switzerland
8 h 30 Workshop package and badge distribution
9 h 00 Welcome and full day workshop program presentation
9 h 10 Keynotes: Power
Module Packaging, Market & Technology trends – Claire Troadec – Yole Développement, France
EV-HEV
Automotive Power Modules Packaging, Innovation & Trends – Elena Barbarini
- System Plus Consulting
10 h 00 Coffee break / Table Top Exhibition
10 h 30 Session 1: Design & Applications
10 h 30 An
efficient tool for modelling piezoelectric cantilevers used for mechanical
energy harvesting – T. Hoang – Greman Laboratory, Tours’s
University, Blois, France
10 h 55 Methodology
of signal and power integrity for multilayer PCB –
Zhifei Xu – Normandy University, UNIROUEN, ESIGELEC, Rouen, France
11 h 20 Thermal design,
modelling and simulation of EDDEMA PCB – Michael Unger – TU Wien University, Vienna,
Austria
11 h 45 Optimized
electrical and thermal layout of 1700V 450A LoPak1 IGBT power module by holistic
design approach – Leonel Soberano – IMI Laguna, Manila, Philippines
12 h 10 Table Top Exhibition visit and Lunch
(Buffet)
13 h 25 Keynotes:
Power Module Packaging, Market & Technology
trends – Jean-Marc Yannou –
ASE Europe, Belgium
14 h 10 Session 2: Materials, Processes & Technologies
14 h 35 Design
of a 3kW power converter using PCB-embedding technology– Cyril Buttay –
Engineering School INSA Lyon and Lyon University, France
15 h 00 Low
temperature sintering technologies for advanced power electronics module
packaging – Chunlei Liu – ABB Corporate Research, Switzerland
15 h 25 Coffee break / Table Top Exhibition
15 h 50 Session 3: Quality & Reliability
15
h 50 Solder with engineered metal matrix - Increased
bondline reliability between power device and Substrate – Graham Wilson – Indium Corporation, United Kingdom
16 h 15 Recent developments of metallized ceramic substrates for the packaging of
power semiconductors – Olivier Mathieu – Rogers Corporation, Germany
16
h 40 Investigation on Cu-Sn
inter-diffusions and intermetallic joints for power semiconductor packaging
– Yousra Bettahi – STMicroelectronics, France
17 h 05
End of session
Next
to the workshop sessions of Thursday, November the 8th, an
exceptional event will be organized to close the workshop day for which you need
to register if you wish to attend:
-
A
visit of famous castle near Tours town. Departure from Greman’s institute at
17h30
-
A
dinner in a gastronomic restaurant around 19h30